Metal Lift Off

The metal lift off process provides an alternative to etching. Many semiconductor devices particularly those made with gallium arsenide (GaAs) or indium phosphide (InP), require the removal of metal layers by etching, but gold, for example, is difficult and expensive to remove by etching due to its inertness. Chemical lift off is a method of patterning a target material (typically a metal) using a sacrificial layer (typically photoresist) to define the pattern. First, the sacrificial layer is applied and patterned; then the target material is deposited on top. The problem is keeping the removed metal layer along with the resist, from redepositing back on the wafers. JST accomplishes this task by using a heated down flow bath where metal and resist are directed down and away from the product. Inline filters in the drain plumbing capture the metal preventing re-deposition back on the substrate. The filters can be cleaned as part of a periodic maintenance routine and costly metal can actually be recovered.

JST has a Class 10 Applications Lab that enables our customers to develop processes using real world process tools, modules and chemicals. This coupled with our partnerships with various chemical vendors allows JST to collaborate and develop cleaning solutions for our customers.

All of JST’s wet lab equipment and lab furniture is designed with safety, reliability and productivity in mind. Our wet processing benches feature a modular design that meets all Semi, CE, NFPA and OSHA requirements. All cleanroom furniture is designed for safe, convenient, clean, and efficient performance in cleanroom environments Our expertise in manufacturing wet bench, cleanroom furniture and accessories includes onsite plastics and metal fabrication as well as mechanical and electrical assembly. As with all JST wet benches, they are designed for ease of maintenance activities and comes with our standard 24/7 Technical Support.

Process Steps

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