Silicon Nitride etch process is used to remove Silicon Nitride from Silicon wafers. The process involves heating of a phosphoric acid solution and maintaining the solution concentration during the process while at or above the solutions boiling point. JST monitors and controls the etching solution concentration and temperature throughout the process with process modules and chemical solution controls designed for this application. JST manufactures wet etch benches designed to perform these etches with extreme precision. While processing, the recipe can be written to constantly agitate the wafers bringing fresh chemistry to the wafer surface improving uniformity.
JST has a Class 10 Applications Lab that enables our customers to develop processes using real world process tools, modules and chemicals. This coupled with our partnerships with various chemical vendors allows JST to collaborate and develop cleaning solutions for our customers.
All of JST’s wet lab equipment, process modules, and lab furniture is designed with safety, reliability and productivity in mind. Our wet processing benches feature a modular design that meets all Semi, CE, NFPA and OSHA requirements. All cleanroom furniture is designed for safe, convenient, clean, and efficient performance in cleanroom environments Our expertise in manufacturing wet benches, cleanroom furniture and accessories includes onsite plastics and metal fabrication as well as mechanical and electrical assembly. As with all JST wet benches, they are designed for ease of maintenance activities and comes with our standard 24/7 Technical Support.
- STEP 1: HF (50:1) – Constant Temperature Bath
- STEP 2: Rinse – Quick Dump Rinser Bath
- STEP 3: Phosphoric Acid – Quartz Nitride Etch
- STEP 4: Rinse – Quick Dump Rinser Bath Recirculated Bath
- STEP 5: SC1 – Quartz Heated Filtered *Optional Megasonics
- STEP 6: Rinse – Quick Dump Rinser Bath
- STEP 7: Dry – STG Dryer