Compound-semiconductor devices frequently incorporate gold and other metal stacks that can be challenging to pattern using conventional subtractive etching. Metal Lift-Off provides an alternative by defining the pattern before metal deposition and subsequently removing the sacrificial resist and unwanted metal. First, the sacrificial layer is applied and patterned; then, the target material is deposited on top. The problem is keeping the removed metal layer and the resist from re-depositing on the wafers. JST accomplishes this task by using a Heated Downflow Bath where metal and resist are directed down and away from the product. Inline filters in the drain plumbing capture the metal, preventing re-deposition back on the substrate. The filters can be cleaned as part of a periodic maintenance routine, and costly metal can actually be recovered.

JST’s Class 10 Applications Lab enables our customers to develop processes using real-world tools, process modules, and chemicals. This, coupled with our partnerships with various chemical vendors, allows JST to collaborate and develop cleaning solutions for our customers.

All of JST’s wet benches and lab furniture are designed with safety, reliability, and productivity in mind. Our wet lab equipment features a modular design that meets all Semi, CE, NFPA, and OSHA requirements. All cleanroom furniture is designed for safe, convenient, and efficient performance in cleanroom environments Our expertise as semiconductor equipment manufacturers includes onsite plastics and contract metal fabrication as well as mechanical and electrical assembly. As with all JST wet benches, our equipment that deploys the Metal Lift-Off process is designed for ease of maintenance activities and comes with our standard 24/7 Technical Support.