Nitride Etch

Nitride Etch

The Nitride Etch process removes the silicon from semiconductor wafers. JST’s wet etch benches are designed to perform these inscriptions with extreme precision.

Nitride Etch Overview

The Nitride Etch process involves heating a phosphoric acid solution and maintaining the solution concentration during the process while at or above the solution’s boiling point. JST monitors and controls the etching solution concentration and temperature throughout the process with process modules and chemical solution controls designed for this application. JST manufactures wet benches designed to perform these etches with extreme precision. While processing, the recipe can be written to constantly agitate the wafers bringing fresh chemistry to the wafer surface and improving uniformity.

JST’s Class 10 Applications Lab enables customers to develop processes using real-world tools, process modules, and chemicals. This, coupled with our partnerships with various chemical vendors, allows JST to collaborate and develop cleaning solutions for our customers.

All of JST’s wet lab equipment, process modules, and lab furniture are designed with safety, reliability, and productivity in mind. Our wet processing equipment features a modular design that meets all Semi, CE, NFPA, and OSHA requirements. All cleanroom furniture is designed for safe, convenient, and efficient performance in cleanroom environments. The company’s expertise as a semiconductor equipment manufacturer includes onsite plastics, contract metal fabrication, and mechanical and electrical assembly.

As with all JST wet benches, the Nitride Etch solution is designed for ease of maintenance activities and comes with standard 24/7 Technical Support.