Closed Loop Vapor Dryer (CLV)

Closed Loop Vapor Dryer (CLV)

The Closed Loop Vapor Dryer (CLV) is a patented ultra-clean IPA Drying technology designed and built to provide optimal wafer drying performance.

  • 304L stainless steel shell and containment
  • 316L electropolished stainless steel process chamber
  • No IPA vapor present during load/unload
  • Sealed vessel with closed loop process
  • Indirect heating of IPA to create vapor
  • CO2 fire suppression system
  • Designed with a programmable logic controller (PLC) in addition to an industrial color touchscreen
  • Modular design for quick replacements and minimal down time
  • Automated lid with two hand safety control
  • Front, side, and rear access maintenance with lift-off panels
  • Recessed dry chamber design pulls chemical fumes through the exhausted dual containment plenum
  • Meets NEC, NFPA, and FM Codes for processing with flammable solvents (IPA)
  • SEMI S2 certification
  • CE marked
  • Flexible dry chamber sizes available
  • Facility bulk chemical dispense of IPA
  • GEM/SECSII factory automation interface
  • 3rd party electrical inspections
  • Heated N2 blow-off for reduced dry cycle time
  • External high volume vacuum pump for reduced dry cycle time
  • Available as a standalone configuration or integrated into a JST Automated Wet Bench for dry-to-dry processing
  • Silicon wafer
  • II-VI compound wafer
  • MEMS
  • Glass substrates
  • Optics and more

Closed Loop Vapor Dryer (CLV) Overview

JST’s Closed Loop Vapor Dryer (CLV) is a combination of two proven drying technologies: vacuum and isopropyl alcohol IPA drying. The patented CLV drying technology is available as a standalone system or integrated into a JST Wet Bench.

In the CLV Dryer, IPA vapor is remotely generated and introduced into the drying chamber where it mixes with and displaces the water. The vapor is then pulled out of the chamber and replaced with ultrapure nitrogen. The closed loop process provides low particle drying for blind holes, vias, and high aspect ratios while reducing IPA usage and emissions.

Applications for the CLV Dryer include silicon wafer, II-VI compound wafer, MEMS, glass substrates, and optics, among others. In a typical performance, the CLV’s dry cycle lasts between 10 and 20 minutes, depending on carrier and product type. It consumes an average of 60mL IPA per drying cycle. Typical particle performance of < 20 adders @ 0.16um or greater per drying cycle. The CLV Dryer emits less than a pound of vapor emissions a day.

As with all JST wet benches, the CLV Dryer is designed for ease of maintenance activities. The CLV Dryer comes with JST’s standard 24/7 Technical Support.

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