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Ospray Single Wafer Wet Process Systems

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Ospray Single Wafer Wet Process Systems

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JST’s Wet Process Systems apply an automated chemical spray to a single wafer for tight process control.

wet-process-systems-JST-product-Ospray
wet process systems
wet process systems
  • Up to 300mm product size capable
  • Material Options: 304L stainless steel, 316L stainless steel, FM-approved PVC-C, or white polypropylene with PTFE spray bowl
  • Internal stainless-Steel frames isolated from process chemistry
  • Automated or manual wafer loading
  • Wafer rotation speed control from 1 rpm to 6,000 rpm with a repeatability of .2 rpm
  • Active gripping or passive spin chuck available
  • DIW backside rinse or backside isolation
  • Programmable servo controlled oscillating spray nozzles
  • Programmable chemical flow rate and pressure control
  • Precision distance control between nozzles and wafer
  • Single pass or chemical recirculation available
  • Designed with a programmable logic controller (PLC) in addition to an industrial PC that controls the entire wet bench
  • Local data logging of all process parameters and lot tracking stored on the PC’s hard drive
  • Ergonomically mounted 23″ color touchscreen monitor, with JST GENII software
  • Ergonomically designed front load/unload access for product cassettes
  • Multiple spray chambers available for increase throughput
  • Rear access maintenance area provides dual containment for reservoirs, pumps, filters, and plumbing
  • GEM/SECSII factory automation interface
  • CO2 fire suppression system
  • Nitrogen and DI water hand spray guns
  • On-board chemical analyzer with integrated concentration control and monitoring for reduced chemical usage
  • SEMI S2 certification
  • CE marking
  • 3rd party electrical inspections

Wet Process Systems Overview

JST’s Wet Process Systems apply an automated chemical spray process to a single wafer for tight process control. This system is equipped with programmable oscillating spray nozzles, wafer speed (RPM), and precision adjustment of the distance between the nozzles and the surface of the wafer. JST’s Wet Process Systems provide process engineers with unprecedented flexibility, precision, and repeatability during the etching and deposition process.

Automated dispensing from the chemical storage reservoir provides repeatable control of volume and mixing. Chemical flow rate and pressure are controlled and programmable. The active gripping or passive spin chucks are designed for DIW backside rinsing or backside isolation. JST’s single-wafer wet process system is compatible with any JST chemical or rinses process modules.

JST’s Single Wafer Wet Process system performs Nitride Etch, KOH Etch, TMAH, Aqua Regia, Silicon, HF/DHF/BOE Oxide Etching, Metal Liftoff, SC1, SC2, Pre-Diffusion Clean, Pre-Gate Clean, and Pre-Metal Clean tasks. JST’s single wafer processing equipment can be configured for either automated or manual wafer loading. Control over wafer rotation speed falls between 1 rpm and 6,000 rpm with repeatability of .2 rpm. This system is customized to user specifications, and offered with a choice of auto or manual wafer loading/unloading configurations.

This wet bench may also be modified to include Photoresist Stripping, Post-Ash Clean, and Post-Implant Resist Strip processes. As with all JST wet benches, single-wafer wet process tools are designed for ease of maintenance activities and come with our standard 24/7 Technical Support.

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FAQs

What is a single-wafer cleaning system?

Single-wafer cleaning systems are wet processing tools designed to clean individual semiconductor wafers in a highly controlled environment. They use specific chemical, rinsing, and drying steps to target and remove microscopic particles and residues from the wafer surface, which is essential to achieving the high purity that silicon and compound semiconductor devices require. By minimizing defects and boosting chip yields, single-wafer cleaning is especially critical for 300mm wafers and devices with smaller geometries or complex 3D structures, where even minimal variations between wafers can significantly impact device performance and reliability.

What is a single-wafer cleaning system?

Single-wafer cleaning systems are wet processing tools designed to clean individual semiconductor wafers in a highly controlled environment. They use specific chemical, rinsing, and drying steps to target and remove microscopic particles and residues from the wafer surface, which is essential to achieving the high purity that silicon and compound semiconductor devices require. By minimizing defects and boosting chip yields, single-wafer cleaning is especially critical for 300mm wafers and devices with smaller geometries or complex 3D structures, where even minimal variations between wafers can significantly impact device performance and reliability.

How does single-wafer cleaning differ from batch wafer cleaning?

Whereas single-wafer cleaning systems process wafers one at a time, batch systems submerge multiple wafers simultaneously in a shared chemical bath or tank. Because of this, single-wafer cleaning systems can offer much more precise control over each wafer’s environment, adjusting process parameters and recipes for individual substrates. Batch systems remain a cost-effective option for high-volume, less critical cleaning steps, but they are precise, making single-wafer cleaning systems useful for advanced or sensitive semiconductor applications. 

What are the main advantages of single-wafer processing?

The main advantages of single-wafer processing are its superior process control, lower risk of particle redeposition, and highly consistent cross-wafer and wafer-to-wafer outcomes. This results in more reliable semiconductor devices with higher production yields. Other benefits include ease of integration into automated production lines, support for rapid recipe changes, and the ability to collect real-time per-wafer process data—enabling advanced feedback and process optimization. Single-wafer systems can also quickly adapt to changes in wafer sizes or process demands, making them ideal for high-mix, high-technology manufacturing needs.

What processes use single-wafer cleaning?

Single-wafer cleaning is used at multiple points in the semiconductor manufacturing process, such as pre-lithography surface preparation, post-etch residue removal, and intermediate cleans and etches between film depositions. It is also employed before wafer-level packaging and backside processing, where strict cleanliness is crucial. The technique is especially important in processes where the smallest contaminants can affect yield or device function, and it is standard in advanced logic, memory, and image sensor fabrication.

How can a single-wafer cleaning system integrate into an existing wet process line?

Integrating a single-wafer cleaning system into an existing wet process line typically involves connecting the system to the fab’s automated wafer handling, tracking, and control infrastructure. Modern single-wafer equipment is designed with modularity and flexible interfaces, making it possible to add to or retrofit existing lines with minimal disruption. Proper integration ensures that the enhanced precision of single-wafer cleaning is maintained within production workflows, while maximizing compatibility with upstream and downstream process steps.

A single-wafer system like JST’s Ospray is ideally suited for ease of integration because it shares chemistries and automation approaches with JST’s established wet benches, allowing operational consistency across the manufacturing floor. Its modular, small-footprint design makes it adaptable for both new and retrofit installations, minimizing the need for excessive fab space. Customers can add up to eight Ospray chambers or configure modules as needed, depending on their capacity and workflow requirements.