With close to 40 years’ experience in Semiconductor Wet Process Equipment manufacturing, JST has an extensive knowledge base and experience with standard Semiconductor Processes. We aligned our process modules to fulfill the needs of common Semiconductor Processes with our expertise to design wet benches in automated and manual configurations to simplify the equipment selection.
We manufacture modular wet processing equipment to take advantage of our process modules to fulfill the needs of common Semiconductor Processes with our expertise to design wet benches in automated and manual configurations to simplify the equipment selection. Our expertise in designing and manufacturing Semiconductor Wet Process Equipment includes onsite plastics and metal fabrication as well as mechanical and electrical assembly. Only quality, reliable, clean room approved components are utilized in the designs to provide long term reliability requiring minimal maintenance. We collaborate with our customers to provide best solutions for lab , fab and HVM requirements, which incorporate reduced chemical usage, reduced footprint and efficient automation for improved throughput to provide the maximum return on investment for customers.
JST has a Class 10 Applications Lab that enables our customers to develop processes using real world process tools, modules and chemicals. This coupled with our partnerships with various chemical vendors allows JST to collaborate and develop cleaning solutions for our customers.
Semiconductor Wet Processes Equipment
Removal of light organics, silicon dioxide layer, particles, metals; protective oxide regrowth.
Wet etching of silicon nitride layer on substrates.
Pre-Gate & Pre-Metal Clean
Removal of light organics, silicon dioxide layer, particles, and metals.
Silicon etch, Polysilicon etch, Silicon Dioxide removal used in the semiconductor process.
Photoresist Strip, Post Ash Clean, Post Implant Resist Strip, Post Etch Resist Strip (Optional SC1)
Positive Photoresist removal without etching silicon, silicon dioxide, silicon nitride or SOI for nonmetal applications.
Metal Lift Off
Negative removal of photoresist, metal.
Bulk silicon etch used to create vias in substrates.
Chemical plating process that deposits a uniform layer of metal alloy on substrate surfaces.