Oxide Etch, Buffered Oxide Etch, Silicon Etch, Polysilicon Etch, & Silicon Dioxide Removal
Oxide etch is used to etch thin films of silicon dioxide (SiO2) or silicon nitride off of silicon wafers. Buffered oxide etch (BOE) process uses a buffering chemical mixed with the HF solution so that the etching process can be reliably controlled for uniform etching across the wafer. Temperature control can be added to the bath which will increase the etch rate and chemical recirculation improves the uniformity as well. JST Manufacturing’s Wet Benches are designed to perform these etches with extreme precision.
JST Manufacturing has a Class 10 Applications Lab that enables our customers to develop processes using real world process tools, modules and chemicals. This coupled with our partnerships with various chemical vendors allows JST to collaborate and develop cleaning solutions for our customers.
All of JST’s wet bench equipment and lab furniture is designed with safety, reliability and productivity in mind. Our wet processing benches feature a modular design that meets all Semi, CE, NFPA and OSHA requirements. All cleanroom furniture is designed for safe, convenient, clean, and efficient performance in cleanroom environments Our expertise in manufacturing wet bench, cleanroom furniture and accessories includes onsite plastics and metal fabrication as well as mechanical and electrical assembly. As with all JST wet benches, they are designed for ease of maintenance activities and comes with our standard 24/7 Technical Support.
- STEP 1: HF (50:1) – Constant Temperature Bath
- STEP 2: Rinse – Quick Dump Rinser Bath
- STEP 3: BOE – Constant Temperature Bath
- STEP 4: Rinse – Quick Dump Rinser
- STEP 5: Dry – STG Dryer