Single Wafer Wet Process System
JST’s single wafer wet process system utilizes an automated chemical spray process on a single wafer. The system includes programmable oscillating spray nozzles, wafer speed (RPM), and precision adjustment of the distance between the nozzles and the surface of the wafer. Automated dispense from the chemical storage reservoir provides repeatable control of volume and mixing. The spin chucks are designed for either DIW backside rinsing or backside isolation. This system is offered with either auto or manual wafer loading/unloading configurations. As with all JST wet benches, they are designed for ease of maintenance activities and come with our standard 24/7 Technical Support.
Single Wafer Wet Processing - Standard Features
- Up to 300mm product size capable
- Material Options: 304L Stainless Steel, 316L Stainless Steel, FM Approved PVC-C, or White Polypropylene with PTFE spray bowl
- Internal Stainless Steel frames isolated from process chemistry
- Automated or Manual wafer loading
- Wafer rotation speed control from 1 rpm to 6,000 rpm with a repeatability of .2 rpm
- Active gripping or passive spin chuck available
- DIW backside rinse or backside isolation
- Programmable servo controlled Oscillating Spray Nozzles
- Programmable chemical flow rate and pressure control
- Precision distance control between nozzles & wafer
- Single pass or chemical recirculation available
- Designed with a programmable logic controller (PLC) in addition to an industrial PC that control the entire wet bench
- Local data logging of all process parameters and lot tracking stored on the PC’s hard drive
- Ergonomically mounted 23” Color Touchscreen Monitor, with JST GENII Software
- Ergonomically designed front load/unload access for product cassettes
Optional Features
- Multiple spray chambers available for increase throughput
- Rear access maintenance area provides dual containment for reservoirs, pumps, filters, and plumbing
- GEM/SECSII Factory Automation Interface
- CO2 Fire Suppression System
- Nitrogen and DI Water Hand Spray Guns
- On-board chemical analyzer with integrated concentration control and monitoring for reduced chemical usage
- SEMI S2 Certification
- CE Marking
- 3rd Party Electrical Inspections
Applications for Single Wafer Wet Process System
- SC1 Clean
- SC2 Clean
- Nitride Etch
- Pre-Gate Clean
- Pre-Metal Clean
- Photoresist Strip, Post Ash Clean, Post Implant Resist Strip, Post Etch Resist Strip (Optional SC1)
- Metal Lift Off
- KOH Etching
- TMAH Etching
- Aqua Regia Etching
- Silicon Wafer Etching
- Lab or fab material cleaning
- HF, DHF, BOE Oxide Etching
