Surface Tension Gradient (STG) Dryer

JST’s STG Dryer is capable of IPA Vapor Drying and DI Water Quick Dump Rinsing (QDR) substrates in a single chamber.  It is available as a standalone system or integrated into a JST Wet Bench.  Utilizing the Marangoni Dryer Principle, the STG dryer provides the lowest particle drying of hydrophobic or hydrophilic wafers with the least IPA usage and emissions.

The STG Dryer has full QDR rinsing capability including top sprays, high flow laminar bottom fill / cascade overflow, and a quick dump valve for fast draining. Ambient IPA vapor is generated using high purity nitrogen and delivered to the chamber for the drying.  In order to provide an inert environment and reduce surface charging of the substrates, programmable Ionized N2 can be introduced for low particle performance. High Purity Heated N2 is used as the final drying step.

The STG Dryer reduces damage and particles common with spin rinse dry processes as there are no moving parts present. The STG dryer consumes less IPA than traditional dryers.  Rinsing and drying occurs in the same chamber reducing the overall footprint needed in the cleanroom.

Typical Performance:

  • 10-20 Minute Dry Cycle depending on carrier and product type
  • 7-15 mL average IPA consumption per drying cycle
  • Typical particle performance of < 10 adders @ 0.16um or greater per drying cycle

As with all JST wet benches, they are designed for ease of maintenance activities and comes with our standard 24/7 Technical Support.

Standard Features

  • FM4910 PVC shell and containment
  • FM4910 PVDF process chamber
  • No IPA Vapor present during load/unload
  • Ambient IPA Vapor Generator with low IPA usage
  • Ionized N2 to minimize surface charging of product
  • Full DI Water Quick Dump rinsing capability
  • Designed with a programmable logic controller (PLC) in addition to an industrial color touchscreen
  • Modular design for quick replacements and minimal down time
  • Automated lid with two hand safety control
  • Front and rear access maintenance with lift-off panels
  • Recessed dry chamber design pulls chemical fumes through the exhausted dual containment plenum
  • Meets NEC, NFPA, and FM Codes for processing with flammable solvents (IPA)
  • SEMI S2 Certification
  • CE Marked
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Optional Features 

  • PFA Teflon and 316L Electropolished Stainless Steel process chambers
  • Flexible dry chamber sizes available
  • Facility bulk chemical dispense of IPA
  • CO2 Fire Suppression System
  • GEM/SECSII Factory Automation Interface
  • 3rd Party Electrical Inspections
  • HF, HCL, H2O2, NH4OH, or other chemical injection in the rinse water for surface cleaning/preparation before dry
  • Selectable multi-directional drains to divert waste water to different facility locations
  • Available as a standalone configuration or integrated into a JST Automated Wet Bench for dry to dry processing
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Applications for STG Dryer

  • Silicon Wafer
  • II-VI Compound Wafer
  • MEMS
  • Glass Substrates
  • Optics and more
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