Closed Loop Vapor Dryer (CLV)
Closed Loop Vapor Dryer (CLV)
The Closed Loop Vapor Dryer (CLV) is a patented ultra-clean IPA Drying technology designed and built to provide optimal wafer drying performance.
Closed Loop Vapor Dryer (CLV) Overview
JST’s Closed Loop Vapor Dryer (CLV) is a combination of two proven drying technologies: vacuum and isopropyl alcohol IPA drying. The patented CLV drying technology is available as a standalone system or integrated into a JST Wet Bench.
In the CLV Dryer, IPA vapor is remotely generated and introduced into the drying chamber where it mixes with and displaces the water. The vapor is then pulled out of the chamber and replaced with ultrapure nitrogen. The closed loop process provides low particle drying for blind holes, vias, and high aspect ratios while reducing IPA usage and emissions.
Applications for the CLV Dryer include silicon wafer, II-VI compound wafer, MEMS, glass substrates, and optics, among others. In a typical performance, the CLV’s dry cycle lasts between 10 and 20 minutes, depending on carrier and product type. It consumes an average of 60mL IPA per drying cycle. Typical particle performance of < 20 adders @ 0.16um or greater per drying cycle. The CLV Dryer emits less than a pound of vapor emissions a day.
As with all JST wet benches, the CLV Dryer is designed for ease of maintenance activities. The CLV Dryer comes with JST’s standard 24/7 Technical Support.
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